MÁY HÀN CHIPSET ZM-R6810
ZM-R6810 Main Features:
1. There are 3 independent heaters. The 1st and 2nd hot-air heaters can control multiple groups and segments temperature parameters. The 2nd heater can move up and down. The 3rd large area IR heater can preheat the PCB board fully to ensure no deformation to the board. Temperature, time, slope, cooling, alarming all can be displayed on the touch screen.
2. High-precision K-type thermocouple with closed loop control, automatic temperature compensation system, combined with Panasonic PLC and highly sensitive temperature module for the precise temperature control, the temperature error controlled within ± 2 degree. The external 4-5 sensors can detect temperature precisely, analyze and calibrate the real temperature curve accurately.
3. V-groove PCB support, rapid positioning, convenience, accuracy, can fit for all kinds of PCB board.
4. Flexible and removable universal fixture has protective effects and no damage to the PCB board, suitable for all kinds of BGA repair.
5. The top heater device and mounting head 2 in 1 design and ball screw driver, z-axis movements are controlled by Panasonic servo system which can accurately control the site and hotspots. With different size alloy BGA nozzles, 360 degree rotation, easy to install and replace, customized is available. Laser positioning function is optional.
6. High-definition CCD color optical vision system, splitting, amplification, micro-adjust and auto-focus, with automatic color resolution and brightness adjustment device. It can adjust the definition of the image manually.
7. Without changing the magnification, the optical lens can be moved manually left and right, back and forth freely. It can observe all aspects of the BGA chip. It displays clearly. The X, Y axis and R angle with micrometer adjust, precise positioning, alignment accuracy is within ± 0.01MM, 15 ? TFT LCD Monitor.
8. CE certification, with emergency switch and automatic power-off protection device when emergency happens, with protective mesh to prevent components falling or human burns happen.
9. Mounting, welding and dewelding process are intelligent controlled and work automatically.BGA mounting position is controlled accurately. After finish desoldering and soldering with a double over-temperature protection, there is an alarming. When temperature goes out of control, the circuit will automatically power off.
10. It can save multiple groups profiles. You can analyze, set and calibrate the temperature parameters curve on the screen at any time. You can print, save and analyze the curve through the USB port without other external devices (such as computer).
11. Powerful cross-flow fan to cool the PCB board automatically after desoldering and soldering, it can prevent the deformation of PCB board to ensure the welding effect.
12. Human-machine interface, high-definition touch screen(Taiwan), PLC control, password protection and calibrate function, can save multiple profiles, instant curve analysis function.
13. With Multifunctional and humanized operation interface, there is "set up " and "operation " interface on the touch screen to prevent wrong operations and setting. Temperature parameter has password protection to stop arbitrary changes.
14. This machine is equipped with pressure and optical sensors. To control the pressure in 3-10 grams and optical switches, so that it can automatically recognize the suction chip and mounting height, to ensure not crush BGA chip. It can repair Socket775 and double BGA / CGA / IC and various shielding devices, meet the requirement of lead-free process.
Specifications and technical parameters:
1. Total Power" 6750W
2. Top heater: 1200W
3. Bottom heater. 2nd heater 1200W,3rd IR heater 4200W
4. power : AC220V±10% 50/60Hz
5. Dimensions: 900*680*900 mm
6. Positioning: V-groove, PCB support can be adjusted in any direction with external universal fixture
7. Temperature control: K-type thermocouple (Closed Loop), heating independently, temperature precision within ±2 degree
8. PCB size: Max 390*450mm Min 125*20 mm
9. Electrical materials : Servo Drive( Panasonic)+Touch screen( Taiwan)+Panasonic PLC+Heating plate(Germany)
10. Camera magnification" 10x-100x
11. Optical system: Japanese original high-definition CCD color imaging system
12. BGA chip 1×1-80×80mm
13. Touch screen " 7.0?, Resolution 640X480, Panel Visa touch screen, external USB interface
14. External temperature sensor" four
15. Work Mode: Power drive
16. Placement Accuracy: X, Y axis and the R angle with micrometer adjust, accuracy within ± 0.01MM
17. Net weight: 85kg